The material, called C-Ply, has a capacitance of 5.5 nF per sq. in., and can reduce component counts in high-speed digital circuit boards. When used as a power-ground core in a multilayer board, it effectively becomes a decoupling capacitor inside the board, 3M says. The material enables faster signaling, reduces power bus noise and EMI, eliminates large numbers of decoupling capacitors, and saves time associated with power distribution design and board layout.

In a press statement, Bill Balliette, new business development manager, 3M Electronic Solutions, said, "Our test marketing has generated considerable customer interest. We're excited to offer OEMs and fabricators a way to improve signal speed and reduce noise using such a high capacitance material."

For a fabrication guide for the materia click here, or click here (http://pcdandm.com/pcdmag/mag/0404/0404peiffer.pdf) to see a related article in the April issue of PCD&M.