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2006 Issues
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 Date Item Title
Friday, 01 December 2006 Value Propositions
Friday, 01 December 2006 Short-Wire Test Fixtures Shrink Targets While Maintaining Integrity
Friday, 01 December 2006 HDI Technology Moves Into Mainstream Design
Friday, 01 December 2006 PBGA Package Lead Modeling Using TDR and IConnect
Friday, 01 December 2006 “So, What Do You Do?”
Friday, 01 December 2006 Free Gerber Viewers: Helping or Hurting our Industry?
Friday, 01 December 2006 Simulation Tools Speed the Design of Embedded Capacitance Layers
Tuesday, 21 November 2006 Don’t Strategize, Trust
Tuesday, 21 November 2006 Report from Chinese Officials of Ministry of Information Industry on China RoHS
Thursday, 02 November 2006 Crystal Clear Reproductions
Wednesday, 01 November 2006 The 2006 Designer and Design Engineer Salary Survey
Wednesday, 01 November 2006 Embedded Passive Test Programs
Wednesday, 01 November 2006 Red-Hot Rage
Wednesday, 01 November 2006 Time for a New Tool
Wednesday, 01 November 2006 3D Thermal Modeling
Wednesday, 01 November 2006 Laminate Material Selection for RoHS Assembly, Parts 1 and 2
Wednesday, 01 November 2006 A Force to be Reckoned With
Friday, 27 October 2006 Lead-Free HAL Final Finishes
Friday, 27 October 2006 Real World Training
Sunday, 01 October 2006 The Paradigm Shift
Sunday, 01 October 2006 Elementary Critical Mass
Sunday, 01 October 2006 Stuff Happens
Sunday, 01 October 2006 Noise Abation
Sunday, 01 October 2006 Electrical Interconnect Modeling Using R, L and C Components
Sunday, 01 October 2006 Guide to Rigid-Flex Design
Sunday, 01 October 2006 RoHS in the Hi-Rel Market
Sunday, 01 October 2006 Next Paradigm Shift: Personal Mobile Phones
Sunday, 01 October 2006 Laser Processing of Flexible Circuits
Sunday, 01 October 2006 The Impact of RoHS on Complex PCBs
Sunday, 01 October 2006 Flex Circuit Manufacturers Collapse in Japan
Saturday, 02 September 2006 High-Speed PCB Design Basics
Saturday, 02 September 2006 How Nanotechnology Applies to Electronics
Saturday, 02 September 2006 The Big Get Bigger
Saturday, 02 September 2006 DFA Demands Upfront Attention
Saturday, 02 September 2006 A Matter of Degrees
Saturday, 02 September 2006 Aiming High
Thursday, 31 August 2006 How Full Is Your Glass?
Thursday, 31 August 2006 Optimizing Interconnect Performance with Eye Diagrams
Thursday, 24 August 2006 SPICEing Up Impedance Profiles
Thursday, 24 August 2006 The Greening of Electronics
Tuesday, 01 August 2006 An Analytical Characterization of PCB Delamination and Comparison of Adhesion Tests
Tuesday, 01 August 2006 Timing Analysis Principles for Digital PCBs, Parts 1, 2 and 3
Tuesday, 01 August 2006 The PCB Melting Pot
Tuesday, 01 August 2006 Lead-Free DFM Demands New Tricks
Tuesday, 01 August 2006 Circuit Boards Are My Life
Tuesday, 01 August 2006 No Faith
Tuesday, 01 August 2006 Halogen-Free Materials: Ready for Prime Time?
Thursday, 27 July 2006 Face Time
Thursday, 27 July 2006 Beating the Heat
Saturday, 01 July 2006 JPCA 2006 Recap
 
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New Product
Mezza-pede Low Profile SMT Connector System
Advanced Interconnections Corporation introduces Mezza-pede, SMT connectors designed for 1 mm-pitch micro board-to-board and flex cable-to-board applications. With a low profile, the screw-machined system is well suited for numerous high reliability applications, such as providing power to tunable lasers.
 
The pin and lead frame design is fully surface mountable, and Mezza-pede has a mated height of 4 mm. Features include screw-machined terminals with multi-finger contacts with a per contact current rating of greater than 1 Amp at 80° C.
 
Mezza-pede comes in standard dual row 8- and 14- position models. Other pin counts and optional enhancements are offered.
 
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