Dow to Debut Microfill LVF Via Fill Electrolytic Copper Print E-mail
Written by Mike Buetow   
Tuesday, 04 December 2012 14:44

Microfill LVF Via Fill electrolytic copper for enhanced microvia filling is for electrolytic copper plating of high density interconnect (HDI) printed circuit boards (PCB). Reportedly is capable of 10–15μm plating thicknesses, microvia filling, high filling efficiency and reduced copper usage. Improves panel and pattern plating distribution and features thermal reliability.

Dow Chemical Co. www.dow.com

 

Last Updated on Tuesday, 04 December 2012 14:48
 

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