Atotech Releases Cupra Etch DE Print E-mail
Written by Mike Buetow   
Monday, 12 November 2012 15:10

Cupra Etch DE is based on iron sulfate etch and effectively removes the seed layer of electroless copper. Eliminates undercuts and reduces waste water. Retains contour of the finest conductors. Requires no "feed and bleed" operation. Does not etch three-dimensionally.

Atotech, www.atotech.com

 

Last Updated on Monday, 12 November 2012 15:13
 

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