Microcopper ink material is based on micron copper particles for direct printing of electronic circuits for mobile devices, solar cells, display devices, etc. Is designed to replace silver-based conductors. Is applied on substrates by additive print processes such as screen, flexographic and gravure printing, as well as dispensing techniques. Is compatible with photosintering curing processes and equipment-enabling printed trace conductors on substrates with max. temperature limitations. Can be used as a patterned seed layer for electroplating and metal finishing.

Applied Nanotech Holdings, www.appliednanotech.net