| Interplex Introduces SMT Card-Edge Connector System |
|
|
| Written by Chelsey Drysdale | |||
| Tuesday, 07 February 2012 18:49 | |||
|
SMT Card-Edge Connector System is based on 0.64mm press-fit technology. Is a discrete pick-and-place SMT component that creates a solderless edge card interconnection for daughter board applications. Contacts can be placed on a daughter card using standard high-speed pick-and-place surface mount equipment. SMD solder interface uses pin-in-paste through-hole technology and recessed channels for solder distribution. Is designed for standard 1.6mm thick printed circuit boards, but is compatible with additional PCB thicknesses. Center min. PCB spacing is 3.2mm. Is packaged in a 16 x 4mm pitch EIA tape on a 13" diameter plastic reel for compatibility to standard high-speed surface mount pick-and-place equipment. Is suitable for high-conductivity material, able to carry up to 15A per contact.
|
Design News
- FabStream, ADI Offer Digi-Key Parts Library
- DRAM Market Getting Tight
- Ansys Sets Q1 Revenue Mark
- EI SiP Meets Missile Interceptor Challenge
- Sweden to Host SI Workshops
- Altium Signs Fisher/Unitech as Midwest US VAR
- NI's Revenue Jump Can't Save Profits
- 2013 PCD&F NPI Design Awards Open
- PCB Designers Roundtable: ‘Trust, But Verify’
- Cadence Posts Q1 Revenue Up 12%
Market News
- Medical Electronics Market to Double, Offering Ample Opps for EMS
- IT Market Being Pulled Down by PC Sluggishness
- Tablet Sales Surged in Q1
- Smartphone Shipments Up 38% in Q1
- IPC: March PCB Orders Down 2.3%
- Solid Forecast for Enterprise Network Equipment Spending
- IC, Packaging Sales to Grow through 2017
- Driver-Assist Systems Market Going Fast on Own
- Study Says US on Track to Compete with China on Cost
- March Semi Spending Better than Last Month, But Not Last Year
Fab News
- SMTA, IPC to Co-locate Fall Events
- LPKF Posts Q1 Revenue Up 60%
- Despite Sequester, Aurora Circuits Reports Q1 Sales Up 12%
- Rogers Restructuring to Cut Annual Spending by $12M
- DoD to Propose Changes to Counterfeit Electronics Procurement Practices
- Cambridge Nanotherm to Build 1st Manufacturing Plant
- Ex Jisso Members Re-Form Under CAMEST Banner
- April Not Cruelest Month for Park
- NIST Publishes Information Security Standard
- Foxconn's April Sales Lower Despite Handset Demand
Products
Vault 1.1 features enhanced searching and filtering tools and design bill of materials for easy-to-use component navigation.
Features
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.


