| Arlon Debuts EP2 Polyimide/Prepreg |
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| Written by Mike Buetow | |||
| Thursday, 19 November 2009 15:58 | |||
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EP2 Enhanced Polyimide is a filled product with copper adhesion superior to traditional polyimides. Is said to reduces water absorption, Arlon, www.arlon-med.com
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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