| DDi Enters into New Licensing with Stablcor |
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| Written by Administrator | |||
| Friday, 09 November 2007 10:03 | |||
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COSTA MESA, CA - Stablcor Incorporated, announced a new licensing agreement with Anaheim, CA-based DDi Corporation. DDi's new agreement with Stablcor eliminates end-product royalties, which were charged to the fabricator before the product could be shipped to the end user. The new licensing policy is being introduced to qualified fabricators to transition STABLCOR® from a specialty material to a general build-up material for use in PCB structures. "We are excited to renew our relationship with Stablcor under its new terms and conditions," stated Raj Kumar, Vice President of Product Development for DDi. "Stablcor's products provide an elegant solution that helps to overcome various design and manufacturing challenges such as in-plane CTE mismatch between the PCB and semi-conductor devices, shock and vibration during a products life cycle and heat dissipation in the X/Y plane. Our new license agreement with Stablcor furthers DDi's continual commitment to providing our customers with leading-edge technology solutions." Stablcor President Douglas J. Tullio said, "Since licensing Stablcor's technology in May 2004, DDi has built the largest array of PCBs utilizing carbon composite laminates in the industry. The combination of customer creativity, DDi's industry knowledge, and our STABLCOR technology has assisted dozens of electronics companies in the development of innovative, lightweight PCB technologies with the required rigidity, controlled CTE, and the ability to overcome thermal challenges. With its large nationwide sales and marketing team, DDi represents significant potential to us through its use of our STABLCOR technology."
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| Last Updated on Friday, 09 November 2007 10:04 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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