SMYRNA, GA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, announced The Future of ECAD-MCAD Collaboration Webinar would be broadcast Sept. 23 at 2 p.m. EDT.
Presented by Mentor Graphics, the free event will explore business drivers and their impact on electro-mechanical design, as seen by the product lifecycle development experts at CIMdata. It also will introduce the industry’s most advanced solution for ECAD/MCAD collaboration, jointly developed by PTC and Mentor Graphics.
Attendees will learn how to link disconnected ECAD-MCAD domains, track incremental updates instead of reviewing large databases with unknown changes, eliminate design re-spins and missed schedules, and how to reduce product development costs while optimizing performance.
The Webinar will be presented by Larry Kenyon, product marketing manager for Mentor Graphics; Pawel Chadzynski, vice president of product management for PTC; and Ken Amann, director of research for CIMdata.
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Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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