SAN JOSE, CA and RABAT, MOROCCO – Tessera Technologies, Inc. and Nemotek S.A. have announced that Nemotek has licensed Tessera’s Shellcase MVP technology, which will reportedly allow OEMs and camera module manufacturers the ability to build smaller and thinner consumer devices, such as camera phones, digital cameras, PDAs and laptops.
“We are making the transition from traditional packaging technology to... through-silicon via wafer-level packaging technology by offering [our] high-volume capabilities to image sensor makers around the world.” said Youssef Benmokhtar, Nemotek’s director of marketing.
“Both Nemotek and their customers will reap the benefits of higher yield and lower production costs, which will be passed on in the form of cost savings throughout the manufacturing supply chain,” said Bents Kidron, Tessera marketing VP.
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ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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