SAN JOSE, CA – Sanmina-SCI Corp. reported a net second-quarter loss, as it reportedly continues to move toward lean manufacturing and increased efficiency to reduce costs.
The company reported a quarterly net loss of $24.4 million as compared to a net loss of $26.1 million for the same period last year.
However, second quarter net sales grew 1.6% to $1.82 billion from $1.79 billion year-over-year.
"We did turn a corner," company chairman and CEO Jure Sola said during a conference call on Wednesday. "We know that this is still a very challenging business, but we are optimistic about the future."
Sola also said that market opportunities in the PCB business are improving, and that the company aims to increase its market share globally, and that it remains committed to improving operating performance.
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Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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