TAIWAN - Prices for printed circuit board (PCB) materials, including glass yarn and copper clad laminate (CCL) are expected to increase in April, but as PCB demand is expected to remain weak for the second quarter, any upward price adjustment remains to be seen.
Several glass yarn makers have already raised prices, with quotes for G75 growing to $1.10 to $1.60, according to industry sources. Taiwan Glass and Glotech Industrial have reportedly already raised prices for April. The price of CCLs have also risen by 10% for April, sources added.
Seasonal PCB slowdown in demand typically helps to keep prices in check in the short term, but Nan Ya recently informed customers that it will raise its CCL prices by 10%, with other manufacturers seeing a price adjustment of about 15%, according to industry sources.
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ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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