MULINO, OR – Sunstone Circuits launches the Sunstone ECOsystem Design Environment, a one-stop resource know-how, capabilities and expertise needed to produce a PCB. The Sunstone ECOsystem eliminates barriers to the successful PCB prototype design, manufacture and assembly process, enabling DfM and DfA methodologies and providing partners with a collaborative environment that the PCB designer, vendor and supplier can work in.
“Sunstone strives to be at the forefront of innovation and creativity in the PCB industry in order to remain the easiest PCB solutions provider to do business with,” said Terry Heilman, CEO of Sunstone Circuits. “We’ve spent the last year bringing the Sunstone ECOsystem to life. This industry-leading resource is one more step in our commitment to support designers from the time their project is conceived up until it is completed, from quote to delivery.” The Sunstone ECOsystem helps prototype and quickturn PCB designers find the knowledge, vendors, tools and libraries needed to design projects and scale up to production with Sunstone’s manufacturing capabilities and partner fabrication and assembly services. See Sunstone Circuits at the IPC Printed Circuit Expo / APEX show in Las Vegas, April 1-3, 2008 at Booth # 2017 to learn more about the ECOsystem Design Environment.
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Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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