Isaac's presentation, Collaboration Across Technology, will
explain how an assembly company identifies inherent design problems and
best practices for communicating upstream to improve layout and
manufacturability.
The keynote address, will be held at 11 a.m. on May 13 at the Holiday Inn Select & Convention Center in Tinley Park, IL.
"Pure design is intellectual. Pure manufacturing is practical. The printed circuit board lies in the middle," explained Isaac.
Isaac has been with The Morey Corp., an electronics manufacturing
services (EMS) company specializing in electronics design and assembly
of for harsh environments, since 2005. He oversees the company’s
technical direction across all products and platforms, including
displays, telematics and controllers. Isaac’s prior experience includes
15 years in wireless communications, systems and embedded technologies
industries. He was lead systems architect for Motorola’s
Telematics Group; served on the Motorola Patent Committee; led several
corporate-wide innovation initiatives; identified new standards and
standard bodies for regional and global telematics, and served as
Distinguished Member of Motorola’s technical staff. He also briefly
served as vice-chairman for the SAE J1939 committee, and held various
leadership roles within the military, government and aerospace
industries prior to Motorola.
Isaac holds two bachelor's degrees in applied physics and mechanical
engineering from McGill University, as well as control systems studies
at the Massachusetts Institute of Technology. He also holds a master's
in biomechanics from the University of Arizona, and a master's in
engineering management from Northwestern University. He holds multiple
key patents.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.