HAMBURG, GERMANY – Seven months after its introduction, Ormecon has announced the first mass production of PCBs using the company’s “Organic Metal Nanofinish."
In an announcement made by company CEO Dr. Bernhard Wessling at the international Printed Circuit Board
Technology Conference in Shanghai, the company will begin regular production schedule of a small amount of boards at a customer
site on March 26.
According to the announcement, April production will increase to 10,000
square feet per month, with production rising to approximately 100,000
square feet per month by mid-year.
The company has over 55 evaluation projects currently in process, with
over 35 of these in PCB manufacturing. Dr. Wessling expressed that the
degree of response in the market is active and positive.
According to the company, the product is provided as ready-to-use
dispersions, lacquers, paints and blends for various applications in
PCB manufacturing, corrosion protection, antistatic
and conductive surface modification, organic and polymer light emitting
diodes (OLEDs, PLEDs), "plastic electronics" and many other
applications.
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ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
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ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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