ORMOND BEACH, FL - Engelmaier Associates
has announced the release of version v.08 of the White Paper titled:
"Recommendations for PCB FAB Notes and Specifications in Printed
Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the
Qualification of PCB Shops and Activities to Assure Continued Quality."
The report covers problems in electronic product reliability caused by
the change to lead-free solders as it concerns PCB fabrication. As
indicated by the title, recommendations are made regarding appropriate
specifications and ‘FAB Notes’ on drawings for printed circuit boards
(PCBs), general procedures to qualify PCB shops, and the assurance of
producing good quality PCBs, with testing procedures to verify quality
and reliability.
Version v.08 includes 29 specific FAB Notes, many with sub-notes, for
the specification of PCBs to be utilized in lead-free solder assemblies.
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ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
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ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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