OAK BROOK, IL - Semiconductor International hosted the 2008 Semiconductor Industry Forecast,
featuring a panel of industry leaders sharing predictions for the New
Year. The panel included Anne Craib of the SIA, Richard Gordon of
Gartner Dataquest Research, Gary Grandbois of iSuppli, Jim Feldhan of
Semico Research, Steve Szirom of InsideChips.com, Moshe Handelsman of
Advanced Forecasting, Gary Smith of Gary Smith EDA, independent analyst
Mike Cowan, and Carl Johnson of Infrastructure.
As reported by PCB Cafe, the panel discussed the demand for traditional
consumer devices (such as MP3 players, digital TVs and cell phones)
accounting for over 50% of semiconductor production, as well as PC
unit demand, now almost 40% consumer-driven.
The majority of the panelists predicted that the worldwide
semiconductor would see growth in the 6-11% range, while three others
predicted a year of flat or even negative growth, siting concerns about
a possible recession in the US due to the higher oil prices and current
mortgage crisis. These concerns have made analysts cautious, but still
optimistic, that semiconductor revenues will continue to grow in 2008.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.