The 2929 bondply system is an unreinforced hydrocarbon-based thin-film adhesive system intended for multilayer circuit constructions. Has a dielectric constant of 2.9 and low loss tangent of <0.003 at microwave frequencies. Proprietary crosslinkable resin system is compatible with sequential bond processing. Adhesive system flow management permits significant blind via fill capability. Is compatible with traditional flat press and autoclave bonding methods. Comes in 0.0015, 0.002, and 0.003 in. (0.038, 0.051, and 0.076mm) sheet thicknesses. Sheets can be stacked to yield thicker adhesive layers. Unreinforced thin film can be tack bonded to innerlayers for simultaneous machining of cutouts through core and adhesive layers. A carrier film protects the adhesive layer from contamination during machining and multi-layer-board booking processes.

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